A Novel Approach For Hermetic Wafer Scale MEMS RF and GaAs Packaging
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چکیده
Technical advances in RF and GaAs devices have generally outpaced those in device packaging. This disparity has created a situation where packaging technology can become a limiter to device performance. A process strategy is presented here for massively parallel creation of hermetic wafer scale packaging for RF devices.
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تاریخ انتشار 2005